• Theme of the Conference
      Materials processing
      Metal working, Joining of materials, Solidification and casting, Mechanical alloying, advanced consolidation techniques, Surface hardening, Vacuum based techniques, Laser processing, Powder processing, Sono-electroplating, Micro- and nano-machining, Vacuum based techniques, Laser processing, Powder processing, Sono-electroplating, Micro- and nano-machining, Thermodynamics and Kinetics of Materials
      Material characterization
      XRD, Electron Microscopy, Spectroscopy techniques, LEED, EXAFS, XPS, SIMS, SPM, EPMA, HAAD, STEM-EELS
      Metal extraction
      Mineral Beneficiation, Advancement in iron and steel making process, newer non-ferrous metal extraction techniques
      Composites
      Metal, ceramic and polymer matrix composites, Hybrid composites, graphene and carbon nano-tube composites, New design and manufacturing technologies, Composites in submarine environment, Applications in chemical industries, field applications and case studies etc
      Surface engineering, thin films and coatings
      Corrosion resistant coatings, high temperature application coatings, hard coatings, vapor deposited thin films and coatings, electroplated coatings, Tribology and Mechanical Behavior of Coatings and Engineered Surfaces, Advanced Characterization Techniques for Coatings and Thin Films etc
      Materials for Energy applications
      Clean Coal Technology, Carbon Capture and Storage, Si solar cell manufacturing, PV manufacturing, Chalcopyrite based solar PV, Materials and technology for flexible solar cells, fuel cells, thermoelectrics and energy storage technologies etc.
      Materials for nuclear, aviation and defense applications
      Bullet proof and Blast proof light weight material, high frequency/high temperature semiconductor devices, high frequency/high temperature semiconductor devices, Explosive Detection, Chemical screening, Super-hard materials, Micro Fuel Cell in MEMS used in Missile systems
      Design of advanced materials
      Graphene, High entropy alloys, high temperature materials, Smart materials, super-alloys. Shape memory alloys, bio-materials, Low temperature or Cryogenic Materials.
      Materials modeling and simulation
      Finite Element Modeling of Materials, Microstructure Modeling of metals and alloys, Numerical Modeling of Metallurgical Processes, Molecular Dynamics Simulation, Ab-initio Modeling of Materials, deformation behavior and fracture, Nano-scale manufacturing processes
      Corrosion and degradation
      Corrosion engineering, Corrosion engineering and applications, Different forms of corrosion, Catastrophic corrosion damage, High-temperature corrosion, Modeling, life prediction and computer applications, Corrosion maintenance, Materials selection for corrosion prevention, Chemical compositions of engineering alloys, Corrosion economics.


  • Registration Process

      Registration Steps

      Click on REGISTER tab and fill up the required details to setup your account.
      After account is created, kindly login to fill the remaining details, upload your passport size photograph and upload your abstract.
      After Abstract is accepted, you will directed to upload the Full Paper and Payment Details through the same account.


      Registration Fees

      Categories
      Indian Delegates
      Foreign Delegates

      **Registration Fee includes Conference Kit, Abstract Volume, Breakfast, Working Lunch, Gala Dinner and Sightseeing



      Payment Details



      Demand Draft to be made in favour of "CONFERENCE NIT ROURKELA" payable at "SBI, NIT ROURKELA"


      Beneficiary Name : CONFERENCE NIT ROURKELA
      Account Number: 36734418111
      IFSC Code: SBIN0002109
      MICR Code: 769002007
      Branch Name: SBl, NlT Campus, Rourkela

      Please mention "ICPCM 2018" and your "Conference Registration Number" in the Payment Description column during Payment
  • Author Information

      Authors are required to strictly adhere to ICPCM Full Paper Template provided below

      ICPCM Full Paper Template
      All the accepted papers will be published in the below mentioned SCI and scopus indexed journals. The papers will go under a stringent review process through the respective journal’s online submission portal. Hence the organizers of the conference shall not be responsible for any rejection due to lack of quality as per the standard of journals.

      Impact Factor: 0.681

      https://www.hanser-elibrary.com/loi/ijmr

      Carl Hanser Verlag GmbH & Co. KG, Munich


      Download IJMR template

      Abstracted/Indexed in: SCOPUS, SJI etc

      https://www.scientific.net/MSF/Details

      TransTech Publications, Switzerland


      Download Science Forum template

      For Technical Queries please contact

      Name Email Phone
      Prof. Krishna Dutta duttak@nitrkl.ac.in 0661-2462568
      Prof. S. N. Alam syedn@nitrkl.ac.in 0661-2462563
      Prof. S. Pal pals@nitrkl.ac.in 0661-2462573
      Prof. R. S. Maurya mauryar@nitrkl.ac.in 0661-2462571
  • Important Dates